Test Items | Test Standard | Test Methods | Test Object | Requirements |
---|---|---|---|---|
End Strength | IEC68-2-21 | F:0402≥3N,0603≥8N,0805≥10N | SNC | No Cosmetic Damage |
Bending Strength |
IEC68-2-21 | h:1±0.1mm | SNC | No Cosmetic Damage ∣△R25/ R25∣≤3% |
Lead Wire Bending |
IEC68-2-21 | F:0.07 |
SNE/SNG |
No Cosmetic Damage |
Lead Pull |
IEC68-2-21 | F:0.3 |
SNE/SNG
|
No Cosmetic Damage |
Drop |
IEC68-2-32 |
Drop height: ±0.1m |
SNC/SNE/ |
No Cosmetic Damage ∣△R25/ R25∣≤1% ∣△B/ B∣≤2% |
Solderability |
IEC68-2-20 |
Soldering Temperature: 260±5℃ Immersion Time: 3±1s |
SNC/SNE/ |
Solder Area ≥95% |
Solder Resistance |
IEC68-2-20 |
Soldering Temperature: 280±10℃ Immersion Time: 10±1s |
SNC/SNE/ |
No Cosmetic Damage |
PN |
No Cosmetic Damage |
|||
Damp Heat Loads |
IEC68-2-2/ IEC68-2-3/ CNS5550 |
Temperature: 40±2℃ |
SNC/SNE/ |
No Cosmetic Damage |
Hot And Cold Shock |
IEC68-2-14 |
Temperature: -40℃,+125℃ Cycle Time: 100,30min/cyc |
SNC/SNE/ |
No Cosmetic Damage |
PN |
No Cosmetic Damage |
|||
High Temperature Load |
IEC68-2-2/ CNS5550 |
Temperature: 125±2℃ |
SNC/SNE |
No Cosmetic Damage |
Temperature: 165±2℃ |
SNG |
No Cosmetic Damage |
||
Temperature: 85±2℃/105±2℃ |
SNS |
No Cosmetic Damage |
||
Temperature: 125±2℃ |
PN |
No Cosmetic Damage |
||
Low Temperature Storage |
IEC68-2-1 |
Temperature: -40±2℃ Time: 1000±24 h |
SNC/SNE/ |
No Cosmetic Damage |
PN |
No Cosmetic Damage |
|||
Insulation Resistance |
MIL-STD-202F -Method 302 |
Insulation Voltage:1000VDC Time: 1 min |
SNC/SNE/ |
No Cosmetic Damage |
Durability |
UL1434 |
Ambient temperature: 25±2℃ |
SNC/SNE/ |
No Cosmetic Damage |
Ambient Temperature: 25±2℃ |
PN |
No Cosmetic Damage |
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